Heat sink structure embedded with heat pipes

ABSTRACT

A heat sink structure embedded with a heat pipe includes a heat dissipation seat, at least one heat pipe, a metal-filling adhesive and at least one covering sheet. The heat dissipation seat has a heat absorption surface and a heat dissipation surface. The heat absorption surface has at least one groove to hold the heat pipe and a bonding medium. The groove is covered by the covering sheet. The metal-filling adhesive is filled with the groove to bond the heat pipe and covering sheet through the bonding medium that can increase adhesion force. The covering sheet covers the heat pipe from being damaged during polishing the heat absorption surface to maintain sealing characteristic of the heat pipe. Therefore, the heat pipe can provide rapid heat conduction effect to meet use requirement.

FIELD OF THE INVENTION

The present invention relates to a heat sink structure and particularly to a heat sink structure embedded with heat pipes.

BACKGROUND OF THE INVENTION

Please refer to FIGS. 1 and 2, a conventional heat sink includes a heat dissipation seat 1 and at least one heat pipe 3. The heat dissipation seat 1 is caved to form at least one groove 2 mating the number of the heat pipe 3. The groove 2 is plated with a layer of nickel through an electroless nickel process or sprayed with a layer of copper powder 5 (shown in the drawings). The heat pipe 3 is filled with fluid (not shown in the drawings) which generates convection when being heated. The convectional fluid provides excellent heat conductivity for the heat pipe 3. The heat pipe 3 is held in the groove 2 which is filled with a metal-filling adhesive 4 such as tin liquor to cover the heat pipe 3. Nickel or copper powder 5 serves as a bonding medium to increase adhesion force to allow the heat pipe 3 to be boned to the groove 2 through the metal-filling adhesive 4.

The heat dissipation seat 1 embedded with the heat pipe 3 thus formed can quickly dissipate heat through rapid heat conduction of the heat pipe 3 and the large area of the heat dissipation seat 1 to prevent high temperature from occurring in local area and improve heat dissipation.

In the aforesaid conventional structure, in order to enhance heat conduction, one side of the heat dissipation seat 1 that holds the heat pipe 3 (i.e. where the groove 2 is formed) usually is treated by polishing to remove the metal-filling adhesive 4 or copper powder 5 that is inadvertently attached thereon so that a smooth surface is formed to increase contact area and improve heat conduction.

However, during the polishing process, due to the metal-filling adhesive 4 is a softer material (generally is formed by cooling and solidifying the heated and molten tin liquor), it cannot effectively protect the heat pipe 3. Hence the heat pipe 3 is prone to be damaged during the polishing process and results in leakage of the fluid held in the heat pipe 3 that loses the rapid heat conduction capability. This could make the conventional heat sink dysfunctional for heat dissipation and not meeting requirement when in use.

SUMMARY OF THE INVENTION

Therefore, the primary object of the present invention is to provide a protection means to prevent the heat pipe from being damaged by polishing and enable the heat pipe to perform rapid heat conduction function to maintain cooling effect of a heat sink.

To achieve the foregoing object, the present invention provides a heat sink structure embedded with a heat pipe that includes a heat dissipation seat, at least one heat pipe, at least one covering sheet and a metal-filling adhesive. The heat dissipation seat has a heat absorption surface and a heat dissipation surface. The heat absorption surface is caved to form at least one groove to hold a bonding medium. The heat pipe is held in the groove. The groove is covered by the covering sheet. The metal-filling adhesive is filled with the groove to securely bond the heat pipe and covering sheet through the bonding medium with enhanced adhesion force.

Therefore, with the heat pipe held in the groove and covered by the covering sheet, when the heat absorption surface of the heat dissipation seat is treated by polishing process, the heat pipe is protected by the covering sheet without being damaged. As a result, the heat pipe can provide rapid heat conduction characteristic, and the heat sink embedded with the heat pipe can provide desired cooling effect to meet requirement when in use.

The foregoing, as well as additional objects, features and advantages of the invention will be more readily apparent from the following detailed description, which proceeds with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view of a conventional heat sink.

FIG. 2 is a perspective view of a conventional heat sink after polished.

FIG. 3 is a schematic view of the heat sink structure of the invention.

FIG. 4 is a perspective view of the heat sink of the invention after polished.

FIG. 5 is a sectional view taken on line A-A in FIG. 4.

FIG. 6 is a schematic view of another embodiment of the invention.

FIG. 7 is a schematic view of yet another embodiment of the invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Please refer to FIGS. 3, 4 and 5, the present invention aims to provide a heat sink structure embedded with a heat pipe. The heat sink structure includes a heat dissipation seat 10, at least one heat pipe 20A, at least one covering sheet 30A and a metal-filling adhesive 40. The heat dissipation seat 10 has a heat absorption surface 11 and a heat dissipation surface 12. The heat dissipation surface 12 has a plurality of radiation fins 14 positioned upright thereon in a juxtaposed manner and spaced from each other with a gap 141. The radiation fins 14 have at least a notch 142.

The heat absorption surface 11 is caved to form at least one groove 13A. In an embodiment, two grooves 13A are formed, but this is not the limitation. Each groove 13A is formed in a curved shape. The grooves 13A are arranged in a crossed fashion. The groove 13A on the heat absorption surface 11 holds a bonding medium 15 that may be made of copper powders (as shown in the drawings) or a nickel plating layer. The copper powders are sprayed and laid uniformly on the heat absorption surface 11 and groove 13A through a sand blasting process. The nickel plating layer is formed on the heat absorption surface 11 and groove 13A by immersing the heat dissipation seat 10 in nickel liquor through an electroless nickel process. The heat pipe 20A is formed in a semicircular shape with two sides formed respectively a circular surface 21 and a flat surface 22. The heat pipe 20A is held in the groove 13A with the circular surface 21 facing downwards to contact with the groove 13A and the flat surface 22 facing upwards.

The covering sheet 30A covers the groove 13A. The metal-filling adhesive 40 is filled with the groove 13A and adhesion force thereof is enhanced through the bonding medium 15 to bond the heat pipe 20A and the covering sheet 30A securely. In this embodiment, the metal-filling adhesive 40 may be heated and molten tin liquor that is cooled and solidified to bond and firmly hold the heat pipe 20A and covering sheet 30A.

Refer to FIG. 6 for another embodiment of the invention in which the three grooves 13B are juxtaposed on the heat absorption surface 11 to hold the heat pipes 20B with corresponding shape and to be covered by the covering sheets 30B with corresponding shape as well.

Refer to FIG. 7 for yet another embodiment of the invention in which the three grooves 13C are juxtaposed on the heat absorption surface 11. Two of the three grooves 13C on outer sides are formed in a curved shape concaved outwards. The grooves 13C hold the heat pipes 20C with corresponding shape and are covered by covering sheets 30C with corresponding shape as well.

As a conclusion, the invention provides covering sheets 30A, 30B and 30C above the heat pipes 20A, 20B and 20C. The covering sheets 30A, 30B and 30C are made of harder material to protect the heat pipes 20A, 20B and 20C from being damaged during polishing process. Thus the heat pipes 20A, 20B and 20C can maintain their sealing characteristics to perform rapid heat conduction function. As a result, the heat sink embedded with the heat pipes 20A, 20B and 20C can achieve desired cooling effect to meet use requirement. 

What is claimed is:
 1. A heat sink structure embedded with a heat pipe, comprising: a heat dissipation seat which includes a heat absorption surface and a heat dissipation surface, the heat absorption surface being caved to form at least one groove to hold a bonding medium; at least one heat pipe held in the groove; at least one covering sheet to cover the corresponding groove; and a metal-filling adhesive filled with the groove to bond the heat pipe and the covering sheet through the bonding medium which increases adhesion force.
 2. The heat sink structure of claim 1, wherein the heat dissipation surface includes a plurality of radiation fins located thereon.
 3. The heat sink structure of claim 2, wherein the radiation fins are spaced from each other with a gap and positioned upright on the heat dissipation surface in a juxtaposed fashion.
 4. The heat sink structure of claim 3, wherein the radiation fins are caved to form at least one notch.
 5. The heat sink structure of claim 1, wherein the heat pipe is formed in a semicircular shape and includes a circular surface and a flat surface on two opposite sides, the circular surface facing downwards to contact with the groove and the flat surface facing upwards.
 6. The heat sink structure of claim 1, wherein the groove includes two sets formed in a crossed fashion, each of the grooves being formed in a curved shape.
 7. The heat sink structure of claim 1, wherein the groove includes three sets formed on the heat absorption surface in a juxtaposed fashion.
 8. The heat sink structure of claim 7, wherein two of the three sets of the grooves on outer sides are respectively formed in a curved fashion concaved outwards. 